Semiconductor lead frame mold introduction

2021-07-16

A semiconductor lead frame mold includes a base, the top of the base is provided with a number of support columns, the top of the support column is provided with a top plate, the top of the top plate is equipped with a hydraulic cylinder, and the telescopic end of the hydraulic cylinder extends below the top plate and is fixedly connected There is an upper template, the surface of the upper template is provided with a guide hole corresponding to the support column, the support column and the guide hole are slidingly connected, the bottom end of the upper template is installed with a convex mold, and the design of the utility model is reasonable , The blanking quality is high, which improves the product quality. The lower template can be moved, which is convenient for loading and unloading, improves safety, and can dissipate heat in time to avoid heat accumulation in the mold and affect product quality.